2169-6317-9UA-1902

Manufacturer: 3M
Category: IC Sockets

Description

PGA

Technical Parameters

Parameter Value
Product Status Obsolete
Type PGA, ZIF (ZIP)
Number of Positions or Pins (Grid) 169 (17 x 17)
Pitch - Mating 0.100" (2.54mm)
Contact Finish - Mating Gold
Contact Finish Thickness - Mating 30.0μin (0.76μm)
Contact Material - Mating Beryllium Copper
Mounting Type Through Hole
Features Closed Frame
Termination Solder
Pitch - Post 0.100" (2.54mm)
Contact Finish - Post Gold
Contact Finish Thickness - Post 30.0μin (0.76μm)
Contact Material - Post Beryllium Copper
Housing Material Polyethersulfone (PES)
Operating Temperature -55°C ~ 150°C

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