20-350000-11-RC-P SOIC to 20-DIP 0.3 Adapter Specs and Cross-Reference
The 20-350000-11-RC-P from Aries Electronics, Inc. is a surface-mount to through-hole adapter board that converts a 20-pin SOIC (Small Outline Integrated Circuit) package into a 0.3-inch (300 mil) wide 20-pin DIP (Dual Inline Package) footprint. Designed for the Adapter, Breakout Boards category within Prototyping and Fabrication Products, this board allows engineers to prototype SOIC-20 devices on standard DIP breadboards, perforated boards, or wire-wrap sockets without designing a custom PCB for initial validation.
The adapter measures 2.000 inches long by 0.450 inches wide (50.80 mm x 11.43 mm), with an FR4 epoxy glass substrate of 0.062-inch (1.57 mm) thickness. It accepts SOIC packages with a 1.27 mm (0.050-inch) pin pitch and routes the 20 pins to two parallel rows spaced 0.3 inches (7.62 mm) apart on the DIP side. This article compares the 20-350000-11-RC-P against its sibling adapters in the Aries 350000-series, provides a specification table for engineering evaluation, and offers selection guidance for specific prototyping scenarios.
350000-Series Sibling Differentiation: Position Count and Pitch Variations
The Aries 350000-series of SMD-to-DIP adapters follows a straightforward nomenclature: the leading number indicates the pin count, followed by the base part code "350000" (or "350002" for some pitch variants), and a suffix denoting RoHS compliance and revision. The sibling list includes 08-350000-11-RC-P (8 positions), 14-350000-11-RC-P (14 positions), 16-350000-10-P (16 positions), 18-350000-11-RC-P (18 positions), 20-350000-11-RC-P (20 positions), 22-350000-10 (22 positions), and board-level variations in the 350002 series such as 28-350002-10-P.
The primary differentiation among siblings is the number of positions, which directly corresponds to the SOIC device pin count the adapter can accommodate. All boards in this family maintain a consistent 0.050-inch SOIC pitch and a 0.3-inch DIP row spacing. Boards with the "-11-RC-P" suffix (including 08, 14, 18, and 20 positions) are the later revision with RoHS-compliant solder finish. The "-10-P" and "-10" suffixes denote earlier revisions that may differ slightly in surface finish or silkscreen layout. For the 22-350000-10, it is advisable to confirm DIP row compatibility because 22-pin DIP packages traditionally use 0.4-inch row spacing, and the specified 0.3-inch spacing may constrain compatible breadboards.
The 28-350002-10-P diverges from the main series by using "350002" instead of "350000", which typically indicates a different SOIC pitch (likely 0.650 mm or a narrower variant, common for 28-pin SOIC packages). Engineers should never assume pin-to-pin compatibility between 350000 and 350002 boards without consulting the respective datasheets.
Specification Table: 20-350000-11-RC-P vs. Key Siblings
| Parameter | Value | Engineering Meaning |
|---|---|---|
| Part Number | 20-350000-11-RC-P | Primary identifier for ordering and BOM entry |
| Number of Positions (SMD side) | 20 | Matches 20-pin SOIC devices (e.g., op-amps, ADC/DAC, memory, CPLDs) |
| Number of Positions (DIP side) | 20 | Two rows of 10 pins at 0.3-inch spacing |
| SOIC Pitch | 0.050" (1.27 mm) | Standard for most SOIC-20 packages; verify device pin pitch before ordering |
| DIP Row Spacing | 0.300" (7.62 mm) | Fits standard 0.3-inch DIP breadboards and sockets |
| Board Thickness | 0.062" (1.57 mm) | Matches typical DIP socket thickness tolerance of 0.015"–0.025" above the PCB |
| Material | FR4 Epoxy Glass | Industry-standard 155°C Tg; good for reflow and hand-soldering up to 260°C peak |
| Board Dimensions | 2.000" L x 0.450" W | Length exceeds some breadboard channels; verify adjacent clearance in dense layouts |
| RoHS Status | Compliant | — |
| Operating Temperature Range | Specialty parameter — see datasheet | FR4 typically supports -40°C to +85°C; confirm for high-reliability or extended-range designs |
| Maximum Soldering Cycles | Specialty parameter — see datasheet | Repeated rework on FR4 pads reduces adhesion; limit to 2–3 cycles per pad |
| 14-350000-11-RC-P (14-pin sibling) | 1.600" L x 0.450" W (estimated) | Shorter board; fits tighter breadboard rows; use for 14-pin SOIC devices |
| 22-350000-10 (22-pin sibling) | Specialty parameter — see datasheet | Confirm DIP row spacing — 22-pin devices often require 0.4-inch spacing, not 0.3-inch |
Critical Specs: Design Implications for Prototyping
The three most impactful specifications for this adapter family are board length, DIP row spacing, and material thickness. At 2.000 inches long, the 20-350000-11-RC-P extends beyond the span of standard 0.3-inch DIP breadboards, which typically have 17 to 20 columns per side. Engineers placing this adapter on a breadboard must account for overhang at the ends, which can block adjacent component rows or interfere with jumper wire routing. The 14-pin sibling is approximately 1.600 inches long and avoids this constraint, making it the better choice when breadboard density is high.
The 0.300-inch DIP row spacing is a fixed mechanical constraint. While most 20-pin DIP sockets use 0.3-inch spacing, some high-voltage or high-current prototyping boards might use 0.6-inch spacing. The adapter will not fit these wider sockets without mechanical modification. Always measure the breadboard or socket hole pattern before soldering the adapter. The 0.062-inch FR4 thickness ensures the DIP pins protrude approximately 0.080–0.100 inches below the board after soldering, sufficient for insertion into standard spring-loaded or machined-pin DIP sockets but possibly short for solder-cup sockets that require longer leads.
The 1.27 mm SOIC pitch requires careful hand-soldering or reflow. Fine-pitch soldering with a 1.5 mm chisel tip and flux-core solder is reliable, but rework after the first solder cycle may lift pads on FR4 if heat is applied for more than 5 seconds per pad. For production-level prototyping runs, consider pre-tinning the board pads and using solder paste and a hot-air rework station for consistent results.
Use-Case Selection Guidance: Which Adapter for Which Prototype
For a 20-pin SOIC ADC prototyping on a standard 830-point breadboard, the 20-350000-11-RC-P is the correct choice because it matches the pin count and pitch. If the same device is used in a dense layout with multiple peripherals, evaluate whether the 2.000-inch length conflicts with adjacent ICs at 0.3-inch spacing. In such cases, a 14-pin or 18-pin adapter may physically fit better even if the device has 20 pins, requiring two adapters for separate functions — this is a valid strategy for modular prototyping.
For 16-pin SOIC devices (e.g., 16-bit DAC, isolated RS-485 transceiver), the 16-350000-10-P is a direct sibling but note the "-10-P" suffix suggests an earlier revision. If RoHS documentation is required for compliance, prefer the "-11-RC-P" variants (08, 14, 18, 20 positions) that explicitly carry RoHS compliance. For 22-pin SOIC devices, the 22-350000-10 may have a wider DIP row spacing; confirm this before ordering, or consider the 28-350002-10-P if the device uses a finer SOIC pitch.
Cross-brand compatibility: Competitors such as Samtec, Mill-Max, and Adafruit offer similar SOIC-to-DIP adapters. Samtec's DIP-ADAPTER series and Mill-Max's 110-44-xxx-41-001000 series provide comparable FR4 boards with gold-plated pads for improved solderability and multiple reflow cycles. The Aries boards are generally lower cost (consult distributor for current pricing) but lack the gold plating of Mill-Max, which matters in high-reliability or high-vibration environments. For standard lab prototyping, the Aries FR4 board with tin-lead or HASL finish is sufficient. For designs requiring >100 thermal cycles or humid environments, Mill-Max gold-plated adapters are preferred.
Drop-In Compatibility and Pinout Verification
The 20-350000-11-RC-P is a passive PCB routing board with no active components. Pin 1 on the SOIC side is marked by a silkscreen dot and connects directly to pin 1 on the DIP side. The trace routing is a straight through-connection with no crossovers or signal conditioning. Engineers must verify the SOIC device datasheet to ensure the manufacturer's pin 1 orientation matches the adapter silkscreen. Most SOIC devices locate pin 1 at the top-left corner when viewed from above with the notch or dot facing left; the Aries adapter follows this convention. If the target SOIC uses a center-pad or exposed-pad thermal slug, this adapter does not provide a corresponding heatsink pad on the DIP side — externally connect the exposed pad via wire to a ground plane on the breadboard.
Mechanical drop-in: The adapter requires soldering the SOIC device on the top side of the board. After soldering, insert the DIP pins into a matching 20-pin DIP socket on the breadboard. The 0.025-inch square DIP pins mate with standard 0.100-inch center machined-pin or spring-loaded sockets. The adapter's 0.450-inch width means it does not overhang into adjacent socket rows on a standard breadboard, but the 2.000-inch length may protrude beyond the breadboard edge if the board is used at the far end of the prototyping area — plan physical placement accordingly.
Frequently Asked Questions About 20-350000-11-RC-P
Frequently Asked Questions About 20-350000-11-RC-P
What SOIC package widths are compatible with the 20-350000-11-RC-P?
The adapter accepts SOIC packages with a 0.050-inch (1.27 mm) pin pitch. Common SOIC-20 widths include 200 mil (5.3 mm) body width pads to pad, and 300 mil (7.5 mm) body width. Verify that the device's body width does not exceed the adapter's 0.450-inch board width. Most standard SOIC-20 devices with 1.27 mm pitch will fit.
Can the 20-350000-11-RC-P be used with a 20-pin TSSOP package?
No. TSSOP (Thin Shrink Small Outline Package) typically uses a 0.65 mm pitch, which is half of the 1.27 mm pitch the adapter is designed for. Attempting to solder a TSSOP-20 to this board would misalign pads and risk bridging. For TSSOP-20, use an adapter with 0.65 mm pitch, such as Aries 20-350002-11-RC-P or a dedicated TSSOP-to-DIP converter.
Does the 20-350000-11-RC-P support surface-mount reflow soldering in a reflow oven?
Yes, the FR4 material withstands standard lead-free reflow profiles with peak temperatures up to 260°C. However, the board lacks solder mask between some pads, so solder paste bridging is possible. Use solder paste stencil aligned to the pad pattern or apply solder paste manually with a fine-tipped syringe. Reflow in a convection oven with a preheat ramp of 1–2°C per second to avoid thermal shock.
Where can I find the mechanical drawing of the 20-350000-11-RC-P for CAD footprint creation?
The official mechanical drawing is available on the Aries Electronics product page for this adapter. It includes exact pad dimensions, hole sizes (typically 0.045-inch diameter for DIP pins), and the board outline with tolerances. Seekcomp provides a link to the datasheet on the product listing. For rapid prototyping, common Eagle and KiCad footprints for 20-pin DIP adapters with 0.3-inch spacing are available online, but always verify dimensions against the Aries drawing to avoid PCB alignment errors.
Selection Decision Summary for 20-350000-11-RC-P
Choose the 20-350000-11-RC-P when your prototype requires a 20-pin SOIC device (1.27 mm pitch) and a 0.3-inch DIP breadboard or socket, and when board length overhang is acceptable. For 8-, 14-, or 18-pin devices, select the corresponding sibling with the "-11-RC-P" suffix for guaranteed RoHS compliance and identical material properties. For 16-pin devices, verify the "-10-P" revision pinout if form-factor precision matters. Before soldering, confirm the SOIC device's pin 1 orientation matches the adapter silkscreen, and mechanically check that the 2.000-inch length fits the prototyping board without blocking adjacent components. For extended temperature or high-vibration environments, consider upgrading to a gold-plated adapter from Mill-Max or Samtec. The Aries 20-350000-11-RC-P remains a cost-effective, reliable prototyping tool for standard lab and field-testing scenarios.
